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Manual Micro Assembly

T-4909 Budget sensitive Manual Die Bonder The T-4909 is a manual, high quality  die bonder with superior ergonomic design.  As with all of Treskys products, the T-4909 incorporates True Vert...
Motorized Bond Axis
Micro Assembly with motorized Bond Axis

T-3000-FC3 Manual Bonder with semi auto. process capabilities The T-3000-FC3 series is Treskys most flexible die bonding platform. The systems can run all basic functions as well as the industries mos...
Semi Automatic
Semi Automatic Micro Assembly

T-3202 Semi Automatic Die Bonder The T-3202 represents a new generation of Windows operated, electronic assembly equipment, featuring a highest possible flexibility and enabling a cost effective solut...
Full Automatic
Full Automatic Die Bonder

T-8000 Flexible Automatic Die Bonder The T-8000 Die Bonder is an all purpose system for R&D, pilot and medium size production.Die handling is standard from 12Wafer, Waffle-Pack and Gel-Pack. Autom...

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