The best solutions for your company
Products
You are here: Products -> SMT SOLUTIONS -> MECHATRONICA -> Reflow Ovens

Reflow Ovens

Reflow Ovens


MR10 Reflow Oven

 

Mechatronika MR10 is a fully programmable far infra red oven, suitable for reflow soldering as well as glue heat drying.

Soldering sections are controlled by a microprocessor, that also enables the storage of up to sixteen parametrized temperature profiles. Ease of programming and safe operation make it specially suitable for small and medium volume production. Autoprofiling equipment shortens set-up time and gaurantee durable solder joints.

 

MR10 Reflow Oven

 

Forced air convection reflow oven MR260

 

The MR260 convection reflow soldering systems uses re-circulated hot air to accomplish reflow at much lower temperatures than IR systems. Using constant, even heating, a great variety of board sizes will reach reflow temperature with the same heat profile. All heating parameters and registered profiles can be easily observed on built-in 17" LCD display. 

By eliminating set-up time your production line can work to its fullest capacity.

 

Image

 

Forced air convection reflow oven MR360

 

The MR360 convection reflow soldering systems uses re-circulated hot air to accomplish reflow at much lower temperatures than IR systems. Using constant, even heating, a great variety of board sizes will reach reflow temperature with the same heat profile.

By eliminating set-up time your production line can work to its fullest capacity.

 

Image

 

Forced air convection reflow oven Mistral 460

 

The Mistral 460 convection reflow soldering systems uses re-circulated hot air to accomplish reflow at much lower temperatures than IR systems. Using constant, even heating, a great variety of board sizes will reach reflow temperature with the same heat profile.

By eliminating set-up time your production line can work to its fullest capacity.

 

Image

 

 

Cloud
17"  460 The  Autoprofiling  Ease  IR  LCD  MR10  MR260  MR260 The  MR360  MR360 The  Mistral  Oven Mechatronika  Reflow  accomplish  air  board  built-in  capacity  capacity Forced  constant  controlled  convection  display By  drying Soldering  durable  easily  eliminating  enables  equipment  fullest  fully  gaurantee  glue  great  heat  heating  hot  infra  joints Forced  line  lower  make  medium  microprocessor  observed  operation  oven  parameters  parametrized  production  profile  profile By  profiles  programmable  programming  re-circulated  reach  red  reflow  registered  safe  sections  set-up  shortens  sixteen  sizes  small  solder  soldering  specially  storage  suitable  systems  temperature  temperatures  time  variety  volume  work  460