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Full Automatic Die Bonder

Full Automatic


T-8000 Flexible Automatic Die Bonder

The T-8000 Die Bonder is an all purpose system for R&D, pilot and medium size production.
Die handling is standard from 12Wafer, Waffle-Pack and Gel-Pack. Automatic Die assembly utilizing pattern recognition is combined with ease of use operation and suited for manual single Die placement.

T-6000 Flexible Automatic Die Bonder

The T-6000 Die Bonder is an all purpose system for R&D, pilot and medium size production.
Die handling is standard from Wafer, Waffle-Pack and Gel-Pack. Automatic Die assembly utilizing pattern recognition is combined with ease of use operation and suited for manual single Die placement.

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12Wafer  Automatic  Bonder  Bonder The  Die  Flexible  Gel-Pack  R&D  T-6000  T-8000  Wafer  Waffle-Pack  assembly  combined  ease  handling  manual  medium  operation  pattern  pilot  placement  placement T-6000  productionDie  purpose  recognition  single  size  standard  suited  system  utilizing