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Manual Micro Assembly

Manual


T-4909 Budget sensitive Manual Die Bonder

The T-4909 is a manual, high quality  die bonder with superior ergonomic design.  As with all of Treskys products, the T-4909 incorporates True Vertical Technology which guarantees parallelism between chip and substrate at any bond height.

T-3002-M Manual Die Bonder

The T-3002-M is a manual, precise, high quality die bonder & component placer with superior ergonomic design and a fix die ejector needle. As with all of Treskys products, the T-3002-M incorporates True Vertical Technology which guarantees parallelism between chip and substrate at any bond height.

The T-3002-M is equiped with Tresky's die ejector system for pick-up from wafer.

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&  Bonder The  Budget  Die  Manual  T-3002-M  T-4909  Technology  Tresky's  Treskys  True  Vertical  bond  bonder  chip  component  design  die  ejector  equiped  ergonomic  fix  guarantees  height T-3002-M  height The  high  incorporates  manual  needle  parallelism  pick-up  placer  precise  products  quality  sensitive  substrate  superior  system  wafer