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Micro Assembly with motorized Bond Axis

Motorized Bond Axis


T-3000-FC3 Manual Bonder with semi auto. process capabilities

The T-3000-FC3 series is Treskys most flexible die bonding platform. The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options. As with all of Treskys products, the FC3 incorporates True Vertical Technology which guarantees parallelism between chip and substrate at any bond height. Together with superior ergonomics the FC3 platform is the industrys most sophisticated system in its class.

T-3002-FC3 Manual DIE BONDER with semi auto. process capabilities

The T-3002-FC3 series is Treskys most flexible die bonding platform. The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options. As with all of Treskys products, the FC3 incorporates True Vertical Technology which guarantees parallelism between chip and substrate at any bond height. Together with superior ergonomics the FC3 platform is the industrys most sophisticated system in its class.

The T-3002-FC3 is equiped with Tresky's die ejector system for pick-up from wafer

 

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BONDER  Bonder  DIE  FC3  Manual  T-3000-FC3  T-3002-FC3  Technology  Tresky's  Treskys  True  Vertical  adding  advanced  applications  auto  basic  bond  bonding  capabilities The  chip  class T-3002-FC3  class The  die  ejector  equiped  ergonomics  flexible  functions  guarantees  height  incorporates  industries  industrys  options  parallelism  pick-up  platform  process  products  range  run  semi  series  sophisticated  substrate  superior  system  systems  wafer  wide