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Semi Automatic Micro Assembly

Semi Automatic

T-3202 Semi Automatic Die Bonder

The T-3202 represents a new generation of Windows operated, electronic assembly equipment, featuring a highest possible flexibility and enabling a cost effective solution of a broad variety of applications. As with all of Treskys products, this semi automatic die bonder , incorporates True Vertical Technology which guarantees parallelism between chip and substrate at any bond height.

The T-3202 is equiped with Treskys die ejector system for pick-up from wafer.



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