Products
You are here: Products -> Soldering -> TRESKY -> Semi Automatic
Semi Automatic Micro Assembly
Semi Automatic
T-3202 Semi Automatic Die Bonder
The T-3202 represents a new generation of Windows operated, electronic assembly equipment, featuring a highest possible flexibility and enabling a cost effective solution of a broad variety of applications. As with all of Treskys products, this semi automatic die bonder , incorporates True Vertical Technology which guarantees parallelism between chip and substrate at any bond height.
The T-3202 is equiped with Treskys die ejector system for pick-up from wafer.
Cloud
Automatic Bonder
The Die Semi T-3202 Technology Treskys True Vertical Windows applications assembly automatic bond bonder broad chip cost die effective ejector electronic enabling equiped equipment featuring flexibility generation guarantees height
The highest incorporates operated parallelism pick-up products represents semi solution substrate system variety wafer
Offers
Our Best Offer for today:
10% discount
for Soldering Products.
BOFA Fume Extractor
Fisnar Robot
Fisnar Dispensing
