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Semiconductor Packaging Solutions %u2013 Material Inspection

Semiconductor Packaging


The 850Gs Combined 2D and 3D capabilities provide full epoxy, paste and underfill measurements.

The 850G 3D Paste capabilities allow for in-line high speed inspection of paste deposition, positional accuracy, volume and height with a resolution down to 4um.

The 2D Flux capabilities allow for flux inspection without the need for florescent additives. Capabilities include; flux boundary and coverage (flow and spread) and positional accuracy.

For Epoxy and Underfill inspection the 850G provides full in-line inspection capability. The unique capabilities of the system allow for the following measurements; Epoxy Boundary (Flow and spread), Epoxy Fillet (Quality and defects), and Excess Epoxy (anywhere in the inspection area).

 

 
 
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Semiconductor Packaging Solutions %u2013 Material Inspection

 

The 850Gs Combined 2D and 3D capabilities provide full epoxy, paste and underfill measurements.

The 850G 3D Paste capabilities allow for in%u2010line high speed inspection of paste deposition, positional accuracy, volume and height with a resolution down to 4um.

The 2D Flux capabilities allow for flux inspection without the need for florescent additives. Capabilities include; flux boundary and coverage (flow and spread) and positional accuracy.

For Epoxy and Underfill inspection the 850G provides full in%u2010line inspection capability. The unique capabilities of the system allow for the following measurements; Epoxy Boundary (Flow and spread), Epoxy Fillet (Quality and defects), and Excess Epoxy (anywhere in the inspection area).

2D 3D Surface

2D Flux Inspection

3D Volumetric Paste Inspection

Surface Topography Measurements

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Die Placement Inspection

 

MVP's 850G provides the highest accuracy flip-chip, die assembly inspection. Ensuring the correct placement of the die on the substrate, while providing edge, FM and surface inspection.

Process yields can be substantially increased using metrology to control the Die alignment processes, flux and paste, prior to reflow, ensuring good parts after this process. With resolutions down to 1um the 850G can provide the highest accuracy for defect detection. In this environment, the systems, as standard, are configured for in-line, high speed die placement metrology.

Correct Die Rotated Die

Correctly Placed Die Rotated Die Surface Inspection Defects
   
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Semiconductor Packaging Solutions %u2013 Component Inspection

 

The Ultra 850XB package inspection system provides the capabilities you need for complete BGA package inspection. MVP provide a range of advanced optics, 3D measurement capabilities and handling solutions to meet your manufacturing requirements.

The Ultra 850XB using flying inspection technology to provide in-tray inspection rather than the movement of the part in the inspection bay, increasing throughput and reducing handling.

The system provides the following capabilities: 

Coplanarity and Height Measurements
Ball Diameter, Shape and Damage
Offsets
Bridging
Missing Balls
Substrate Damage

   
Component Inspection

 

 

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Wire Bond Inspection

 

Whether you are using 20um gold wire or 250um Aluminum wire, ball bonds or wedge bonds, MVP%u2019s 850G provided the resolution and capabilities for complete wire bond inspection.

MVP%u2019s proprietary algorithms use multi%u2010registration techniques to accommodate for bond and die placement, to allow complete wire and bond inspection across different substrates and dies.

To allow for the inspection of multi-level substrates MVP provide our proprietary Z-Height module, making the Ultra 850G the most flexible wirebond inspection solution.

Leading Capabilities Include:

1um Resolution
Bump/Ball Inspection
Gold, Copper and Aluminum Wire
Bond Shape, Position and Dimensions
Epoxy Flow and Spread
Die Placement
Die Surface, Edge Cracking, Damage
Foreign Material

 
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Semiconductor and Microelectronics Core Competencies

 

CORE ENGINEERING

High quality products start with good design. Machine Vision Products (MVP) brings added value to the customer by providing design and engineering services to meet your custom Microelectronics and Semiconductor inspection requirements.

 

 

engeneering

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SYSTEM MANUFACTURING


Based in Carlsbad. California, MVP provide full design and manufacturing services for all their optics, hardware and custom handling solutions. Our skilled, machiners, assembly and test engineers provide the highest quality system solutions. In addition MVP provide software for all of the platforms from a core team ofalgoridYn experts based in our Carlsbad location.

 
APPLICATIONS


MVP's proprietary algorithm suite provides the highest level of inspection for integrated automatic production lines, built around a series of high resolution 20 and 3D optics packages, to provide rapid, cost-efficient measurement of microelectronics and semiconductor components.

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CUSTOMER FOCUS


Once a solution has been deployed MVP continue customer and appfications support through a class-leading team offield based engineers. System installation, training, applications development, project managment and system enhancements are all services provided by MVP to any location world·wide.

 

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