Semiconductor Packaging
Trade Shows l Articles l News l Newsletter l Legal l Privacy l Financing
Semiconductor Packaging Solutions %u2013 Material Inspection
The 850Gs Combined 2D and 3D capabilities provide full epoxy, paste and underfill measurements. |
||||||||||
|
Trade Shows l Articles l News l Newsletter l Legal l Privacy l Financing
Die Placement Inspection
MVP's 850G provides the highest accuracy flip-chip, die assembly inspection. Ensuring the correct placement of the die on the substrate, while providing edge, FM and surface inspection. Process yields can be substantially increased using metrology to control the Die alignment processes, flux and paste, prior to reflow, ensuring good parts after this process. With resolutions down to 1um the 850G can provide the highest accuracy for defect detection. In this environment, the systems, as standard, are configured for in-line, high speed die placement metrology. |
||||||||||||||
|
Trade Shows l Articles l News l Newsletter l Legal l Privacy l Financing
Semiconductor Packaging Solutions %u2013 Component Inspection
|
||||||
|
Trade Shows l Articles l News l Newsletter l Legal l Privacy l Financing
Wire Bond Inspection
Whether you are using 20um gold wire or 250um Aluminum wire, ball bonds or wedge bonds, MVP%u2019s 850G provided the resolution and capabilities for complete wire bond inspection.
|
||||||
|
Trade Shows l Articles l News l Newsletter l Legal l Privacy l Financing
Semiconductor and Microelectronics Core Competencies
![]() |
|||||||||||||||||||||||
|
|||||||||||||||||||||||
Trade Shows l Articles l News l Newsletter l Legal l Privacy l Financing
All rights reserved for Machine Vision Products, INC
Our Best Offer for today:
10% discount
for Soldering Products.