The 850Gs Combined 2D and 3D capabilities provide full epoxy, paste and underfill measurements.

The 850G 3D Paste capabilities allow for in-line high speed inspection of paste deposition, positional accuracy, volume and height with a resolution down to 4um.

The 2D Flux capabilities allow for flux inspection without the need for florescent additives. Capabilities include; flux boundary and coverage (flow and spread) and positional accuracy.

For Epoxy and Underfill inspection the 850G provides full in-line inspection capability. The unique capabilities of the system allow for the following measurements; Epoxy Boundary (Flow and spread), Epoxy Fillet (Quality and defects), and Excess Epoxy (anywhere in the inspection area).

The 850Gs Combined 2D and 3D capabilities provide full epoxy, paste and underfill measurements.

The 850G 3D Paste capabilities allow for in%u2010line high speed inspection of paste deposition, positional accuracy, volume and height with a resolution down to 4um.

The 2D Flux capabilities allow for flux inspection without the need for florescent additives. Capabilities include; flux boundary and coverage (flow and spread) and positional accuracy.

For Epoxy and Underfill inspection the 850G provides full in%u2010line inspection capability. The unique capabilities of the system allow for the following measurements; Epoxy Boundary (Flow and spread), Epoxy Fillet (Quality and defects), and Excess Epoxy (anywhere in the inspection area).

MVP's 850G provides the highest accuracy flip-chip, die assembly inspection. Ensuring the correct placement of the die on the substrate, while providing edge, FM and surface inspection.

Process yields can be substantially increased using metrology to control the Die alignment processes, flux and paste, prior to reflow, ensuring good parts after this process. With resolutions down to 1um the 850G can provide the highest accuracy for defect detection. In this environment, the systems, as standard, are configured for in-line, high speed die placement metrology.

Whether you are using 20um gold wire or 250um Aluminum wire, ball bonds or wedge bonds, MVP%u2019s 850G provided the resolution and capabilities for complete wire bond inspection.

MVP%u2019s proprietary algorithms use multi%u2010registration techniques to accommodate for bond and die placement, to allow complete wire and bond inspection across different substrates and dies. To allow for the inspection of multi-level substrates MVP provide our proprietary Z-Height module, making the Ultra 850G the most flexible wirebond inspection solution. Leading Capabilities Include:
1um Resolution Bump/Ball Inspection Gold, Copper and Aluminum Wire Bond Shape, Position and Dimensions Epoxy Flow and Spread Die Placement Die Surface, Edge Cracking, Damage Foreign Material